The metallization of Aluminium nitride ceramics
1. It is possible to apply a membrane process on almost any material substrate. But, to achieve a stronger bonding system between substrate and metal films, it is important that their thermal expansion coefficients be as close as possible.
2. Thick film method: Thick film metalization is a method that covers ceramic with thick film paste. It follows a pattern created on the aluminum-nitride ceramic substrate by screen printing, or using other technologies. Different requirements can be met by brazing metal layers, circuits and leads connections after sintering
3. Mo-Mn is also known as the high-melting metal method. It uses the Mo-Mn metallization method. This involves using a mixture of Mo and low-melting Mn to metallize the ceramic. Then you add binder to finish the coating.
4. The Electroless plating Method, To use an electroless plating agent to reduce the amount of metal ions found in the solution to the catalytic activity surface to form metal coatings.
5. This is a direct copper coating technique. It uses oxygen elements between Cu ceramics and Cu ceramics to first form Cu/O eutectic phase at 10651083, and then reacts directly with ceramic matrix or copper foil to produce Cu(AlO2)2. Then, it bonds the copper foil and matrix through mesophase.
Application of aluminum nitride
Aluminum nitride can be described as a natural crystal with a hexagonal structure. This allows for strong covalent bonds, low heat resistance and corrosion resistance. While aluminum is considered a semiconductor because of its bandwidth, electric strength, volume resistance, dielectric coefficient, group of the low-power, and other properties, it is possible to separate into insulators. Piezoelectric ceramics were created by using these piezoelectric qualities.
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